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Microwave Photonic T/R Module

Description

The product uses photonic integrated design, integrating thin-film LiNbO3 intensity modulator, InGaAs photo-detector, low noise microwave amplifier and control circuit, which can achieve photoelectric and electro-optical bidirectional conversion of RF signals. Electro-optic and photoelectric time-sharing work, through RS485 signal control, to achieve electro-optic/photoelectric channel switching and attenuation control. The frequency is up to 40 GHz, 3dB bandwidth over 20GHz, small size.The product has the advantages of wide frequency range, high integration, small size, light weight, no external circuit requirements, wide operating temperature range, small bending radius of optical fiber, and strong environmental adaptability.Meeting the requirements of miniaturization and high reliability. It can be customized according to customer requirements.


Application                                                                                                 Features

Microwave optical transmission links                                                      Integrated thin-film LiNbO3 intensity modulator
High speed optical fiber communication system                                Photodetector, microwave amplifier and controls circuit
Other analog optical transmission                                                            Frequency up to 40 GHz
                                                                                                                                  3
dB Bandwidth over 20GHz
                                                                                                                                  Compact small size
                                                                                                                                  Operating temperature -50~70℃
                                                                                                                                  No external circuit requirement
                                                                                                                                  Meeting the requirements of miniaturization
                                                                                                                                  and high reliability




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